VIEW
VIEW offers a complete line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
For more information, contact us.
VIEW Benchmark 250
A Compact, High-Accuracy Dimensional Measurement System.
XYZ Travel: 300 x 150 x 200 mm
Load Capacity: 25 KG
Features: The Benchmark 250 is well suited to measure many types of components, including molded plastic parts, machined parts, electronic assemblies, semiconductor packages, fiber optic components, disk media substrates, recording head dies, or semiconductor wafers up to 150 mm in diameter.
VIEW Benchmark 300
High Performance Floor Model Optical Metrology System
XYZ Travel: 300 x 300 x 200 mm
Load Capacity: 30 KG
Features: The Benchmark 300 is designed for use on the production floor to provide precision measurements for process control. Its stage is ideal for medium format metrology applications that require high throughput, accuracy, and the precision you expect from VIEW.
VIEW Benchmark 450
Exceptional Value in a High-Accuracy Dimensional Measurement System
XYZ Travel:
450 x 450 x 200 mm (Standard)
450 x 600 x 200 mm (Optional)
Load Capacity: 65 KG
Features: Dual magnification optics and an optional through-the-lens (TTL) laser sensor make the Benchmark 450 an ideal system for many applications including molded plastic parts, screen printer stencils, printed circuit boards, solder paste, epoxy glue dots, precision machined parts, and many others.
VIEW Benchmark XLT
Extra Large Format Dimensional Metrology System
XYZ Travel:
B-1500 – 900 x 1500 x 150 mm
B-1550 – 1250 x 1500 x 150 mm
B-1552 – 1500 x 1500 x 150 mm
B-2250 – 1250 x 2000 x 150 mm
B-2500 – 1550 x 2000 x 150 mm
Optional:
Y-axis – 1800 mm
Z-axis – 200 mm
Load Capacity:
50 KG load evenly distributed on glass
100 KG load evenly distributed on observation platform
Features: The XLT offers extended travel ranging from 900 mm x 1500 mm to 1500 mm x 2000 mm to handle large area parts or nested groups of smaller parts. The XLT’s moving bridge design features an open work envelope for loading and unloading large parts.
Pinnacle 250
A High Throughput, High-Accuracy Dimensional Metrology System
XYZ Travel: 250 x 150 x 100 mm
Load Capacity: 25 KG
Features: The Pinnacle is ideal for measurement of small, close tolerance parts, particularly parts with a high density of features, such as hard disk drive suspensions, printer heads, precision stampings, leadframes, ball-grid arrays, and chip scale packages.
Pinnacle Plus
Elevates Pinnacle Performance to the Next Level
XYZ Travel: 250 x 150 x 100 mm
Load Capacity: 25 KG
Features: Pinnacle+ Plus’ state-of-the-art linear motion control technology provides the fastest, most reliable platform available for high volume, high capacity operation in production environments ranging from clean rooms to factory floors.
Summit 600/625/800
A Large Travel, High-Accuracy Dimensional Measurement System
XYZ Travel:
600 – 450 x 600 x 150 mm
625 – 615 x 610 x 150 mm
800 – 800 x 820 x 150 mm
Load Capacity:
600 – 50 KG
625 – 50 KG
800 – 75 KG
Features: The Summit systems are ideal for measurement of large format parts requiring high accuracy, such as solder paste stencils and screens, artwork, panelized printed circuit boards, flex circuits, and micro-etched parts.
Microline AF
Offers Exceptional Linewidth and Overlay Measurement Capability
XYZ Travel:
1000 – 100 x 100 x 175 mm
2000 – 200 x 200 x 175 mm
3000 – 300 x 300 x 145 mm
Features: The MicroLine systems are well suited to measure wafers, masks, MEMS, and other micro-fabricated parts. These capable desktop instruments provide precise optical measurement for features as small as 0.5 microns on parts up to 300 x 300 mm.
Microline AF Plus
Offers Exceptional Linewidth and Overlay Measurement Capability
XYZ Travel:
1000 – 100 x 100 x 175 mm
2000 – 200 x 200 x 175 mm
3000 – 300 x 300 x 145 mm
Features: The MicroLine systems are well suited to measure wafers, masks, MEMS, and other micro-fabricated parts. These capable desktop instruments provide precise optical measurement for features as small as 0.5 microns on parts up to 300 x 300 mm.