VIEW offers a complete line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
A Compact, High-Accuracy Dimensional Measurement System. XYZ Travel: 300 x 150 x 200 mm Load Capacity: 25 KG
Features: The Benchmark 250 is well suited to measure many types of components, including molded plastic parts, machined parts, electronic assemblies, semiconductor packages, fiber optic components, disk media substrates, recording head dies, or semiconductor wafers up to 150 mm in diameter.
VIEW Benchmark 450
Exceptional Value in a High-Accuracy Dimensional Measurement System XYZ Travel: 450 x 450 x 200 mm (Standard) 450 x 600 x 200 mm (Optional) Load Capacity: 65 KG
Features: Dual magnification optics and an optional through-the-lens (TTL) laser sensor make the Benchmark 450 an ideal system for many applications including molded plastic parts, screen printer stencils, printed circuit boards, solder paste, epoxy glue dots, precision machined parts, and many others.
Pinnacle 250
A High Throughput, High-Accuracy Dimensional Metrology System XYZ Travel: 250 x 150 x 100 mm Load Capacity: 25 KG
Features: The Pinnacle is ideal for measurement of small, close tolerance parts, particularly parts with a high density of features, such as hard disk drive suspensions, printer heads, precision stampings, leadframes, ball-grid arrays, and chip scale packages.
Pinnacle Plus
Elevates Pinnacle Performance to the Next Level XYZ Travel: 250 x 150 x 100 mm Load Capacity: 25 KG
Features: Pinnacle+ Plus’ state-of-the-art linear motion control technology provides the fastest, most reliable platform available for high volume, high capacity operation in production environments ranging from clean rooms to factory floors.
Summit 600/625/800
A Large Travel, High-Accuracy Dimensional Measurement System XYZ Travel: 600 – 450 x 600 x 150 mm 625 – 615 x 610 x 150 mm 800 – 800 x 820 x 150 mm Load Capacity: 600 – 50 KG 625 – 50 KG 800 – 75 KG
Features: The Summit systems are ideal for measurement of large format parts requiring high accuracy, such as solder paste stencils and screens, artwork, panelized printed circuit boards, flex circuits, and micro-etched parts.
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